SCHS231E November   1998  – August 2024 CD54AC74 , CD74AC74

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Electrical Characteristics
    6. 4.6  Timing Requirements, VCC = 1.5 V
    7. 4.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 4.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 4.9  Switching Characteristics, VCC = 1.5 V
    10. 4.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 4.11 Switching Characteristics, VCC = 5 V ± 0.5 V
    12. 4.12 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1.     Power Supply Recommendations
    2. 7.1 Layout
      1. 7.1.1 Layout Guidelines
      2. 7.1.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Thermal Information

THERMAL METRIC(1) CDx4AC74 UNIT
N (PDIP) D (SOIC)
14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 80 119.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.