SCHS167G November   1998  – October 2022 CD54HC240 , CD54HC244 , CD54HCT240 , CD54HCT241 , CD54HCT244 , CD74HC240 , CD74HC241 , CD74HC244 , CD74HCT240 , CD74HCT241 , CD74HCT244

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings (1)
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics '240
    5. 5.5 Electrical Characteristics '241
    6. 5.6 Electrical Characteristics '244
    7. 5.7 Switching Characteristics '240
    8. 5.8 Switching Characteristics '241
    9. 5.9 Switching Characteristics '244
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • J|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Thermal Information

THERMAL METRIC DW (SOIC) DB (SSOP) N (PDIP) NS (SO) PW (TSSOP) UNIT
20 PINS 20 PINS 20 PINS 20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance(1) 109.1 122.7 84.6 113.4 131.8 °C/W
RθJC (top) Junction-to-case (top) thermal resistance 76 81.6 72.5 78.6 72.2 °C/W
RθJB Junction-to-board thermal resistance 77.6 77.5 65.3 78.4 82.8 °C/W
ΨJT Junction-to-top characterization parameter 51.5 46.1 55.3 47.1 21.5 °C/W
ΨJB Junction-to-board characterization parameter 77.1 77.1 65.2 78.1 82.4 °C/W
RθJC (bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.