SCHS328C January   2003  – July 2024 CD54AC138 , CD74AC138

PRODUCTION DATA  

  1.   1
  2. Features
  3. Description
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics
    6. 4.6 Switching Characteristics, VCC = 1.5V
    7. 4.7 Switching Characteristics, VCC = 3.3V ± 0.3V
    8. 4.8 Switching Characteristics, VCC = 5V ± 0.5V
    9. 4.9 Operating Characteristics
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Power Supply Recommendations
    3. 7.3 Layout
      1. 7.3.1 Layout Guidelines
      2. 7.3.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • PW|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

CD54AC138 CD74AC138  CD54AC138 J Package; CD74AC138 D, N,
                        or PW Package; 16-Pin CDIP,  SOIC, PDIP, or TSSOP (Top View)Figure 3-1 CD54AC138 J Package; CD74AC138 D, N, or PW Package; 16-Pin CDIP, SOIC, PDIP, or TSSOP (Top View)
CD54AC138 CD74AC138  CD74AC138 BQB Package, 16-Pin WQFNFigure 3-2 CD74AC138 BQB Package, 16-Pin WQFN
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A 1 I Input A
B 2 I Input B
C 3 I Input C
G2A 4 I Strobe Input 2A, active low
G2B 5 I Strobe Input 2B, active low
G1 6 I Strobe Input
Y7 7 O Output 7
GND 8 G Ground
Y6 9 O Output 6
Y5 10 O Output 5
Y4 11 O Output 4
Y3 12 O Output 3
Y2 13 O Output 2
Y1 14 O Output 1
Y0 15 O Output 0
VCC 16 P Positive Supply
Thermal Pad(2) Thermal Pad
I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
BQB package only