SCHS346C April   2003  – October 2024 CD74AC174

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Application
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 1.5 V
    7. 5.7  Timing Requirements, VCC = 3.3 V ± 0.3 V
    8. 5.8  Timing Requirements, VCC = 5 V ± 0.5 V
    9. 5.9  Switching Characteristics, VCC = 1.5 V
    10. 5.10 Switching Characteristics, VCC = 3.3 V ± 0.3 V
    11. 5.11 Switching Characteristics, VCC = 5 V ± 0.5 V
    12. 5.12 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Power Supply Recommendations
    2. 8.2 Layout
      1. 8.2.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • BQB|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (April 2024) to Revision C (October 2024)

  • Added BQB and PW packages to Package Information table, Pin Configuration and Functions section, and Thermal Information tableGo

Changes from Revision A (November 2023) to Revision B (April 2024)

  • Updated thermal values for D package from RθJA = 73 to 106.6, all values in °C/W Go