SCHS347A April   2003  – April 2024 CD74AC175

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configurations and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Timing Requirements, VCC = 1.5V
    7. 5.7  Timing Requirements, VCC = 3.3V ± 0.3V
    8. 5.8  Timing Requirements, VCC = 5V ± 0.5V
    9. 5.9  Switching Characteristics, VCC = 1.5V
    10. 5.10 Switching Characteristics, VCC = 3.3V ± 0.3V
    11. 5.11 Switching Characteristics, VCC = 5V ± 0.5V
    12. 5.12 Operating Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Power Supply Recommendations
    2. 8.2 Layout
      1. 8.2.1 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) D (SOIC) UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance 106.6 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). The package thermal impedance is calculated in accordance with JESD 51-7.