Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
D|16
Thermal pad, mechanical data (Package|Pins)
9 Revision History
Changes from Revision * (August 1998) to Revision A (August 2024)
Deleted references to CD74ACT251 throughout the data
sheetGo
Added Package Information table, Pin Functions table,
ESD Ratings table, Thermal
Information table, Device Functional
Modes,Application and
Implementation section, Device and Documentation Support
section, and Mechanical, Packaging, and
Orderable Information section Go