SCHS285B December   1998  – May 2024 CD54AC541 , CD54ACT540 , CD54ACT541 , CD74AC540 , CD74AC541 , CD74ACT540 , CD74ACT541

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3  Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 Electrical Characteristics, AC Series
    6. 4.6 Electrical Characteristics, ACT Series
    7. 4.7 Switching Characteristics, AC Series
    8. 4.8 Switching Characteristics, ACT Series
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • N|20
  • DW|20
Thermal pad, mechanical data (Package|Pins)

4.4 Thermal Information

THERMAL METRIC(1) CD74AC540, CDx4ACT54x, CDx4AC541 UNIT
N (PDIP) DW (SOIC)
20 PINS 20 PINS
RθJA Thermal Resistance 69 101.2 °C/W
(1) The package thermal impedance is calculated in accordance with JESD 51.