9 Revision History
Changes from Revision B (April 2024) to Revision C (July 2024)
- Added BQB and PW packages to Device Information table, Pin
Configuration and Functions section, and Thermal Information
tableGo
- Changed E and M packages to N and D throughout data sheetGo
Changes from Revision A (February 2003) to Revision B (April 2024)
- Added Package Information table, Pin Functions table,
ESD Ratings table, Thermal
Information table, Device Functional
Modes,Application and
Implementation section, Device and Documentation Support
section, and Mechanical, Packaging, and
Orderable Information section Go
- Updated RθJA values: M = 73 to 106.6, all values in °C/W Go