SCHS240D November   1998  – October 2024 CD54AC164 , CD54ACT164 , CD74AC164 , CD74ACT164

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 ESD Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Thermal Information
    5. 4.5 DC Electrical Specifications
    6. 4.6 Prerequisite for Switching Function
    7. 4.7 Switching Specifications
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Standard CMOS Inputs
      2. 6.3.2 TTL-Compatible CMOS Inputs
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
        1. 7.2.1.1 Power Considerations
        2. 7.2.1.2 Input Considerations
        3. 7.2.1.3 Output Considerations
        4. 7.2.1.4 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support (Analog)
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
  • BQA|14
  • N|14
Thermal pad, mechanical data (Package|Pins)

10 Revision History

Changes from Revision C (April 2024) to Revision D (October 2024)

  • Added BQA and PW packages to Device Information table, Pin Configuration and Functions section, and Thermal Information tableGo
  • Added Feature Descriptions section, Typical Application section, and Layout Example diagramGo
  • Changed pin names throughout data sheet: DS1 → A, DS2 → B, Q0 → QA, Q1 → QB, Q2 → QC, Q3 → QD, CP → CLK, !MR → CLR,, Q4 → QE, Q5 → QF, Q7 → QG, → QH, → VCC Go

Changes from Revision B (November 2023) to Revision C (April 2024)

  • Updated RθJA values: D = 175 to 106.6, all values in °C/W Go