SCHS248B November   1998  – August 2024 CD54AC257 , CD54ACT257 , CD74AC257 , CD74ACT257 , CD74ACT258

PRODUCTION DATA  

  1.   1
  2. Features
  3. Description
  4. Pin Configuration and Functions
  5. Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Specifications
  6. Parameter Measurement Information
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
  9. Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage -0.5 6 V
IIK Input diode current VI < -0.5V or VI > VCC + 0.5V ±20 mA
IOK Output diode current VO < -0.5V or VO > VCC + 0.5V ±50 mA
IO Output source or sink current per output pin VO > -0.5V or VO < VCC + 0.5V ±50 mA
ICC or IGND (2) VCC or ground current ±100 mA
Tstg Maximum storage temperature -65 150 °C
Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
For up to 4 outputs per device, add ±25mA for each additional output.