SCHS167G November   1998  – October 2022 CD54HC240 , CD54HC244 , CD54HCT240 , CD54HCT241 , CD54HCT244 , CD74HC240 , CD74HC241 , CD74HC244 , CD74HCT240 , CD74HCT241 , CD74HCT244

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings (1)
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics '240
    5. 5.5 Electrical Characteristics '241
    6. 5.6 Electrical Characteristics '244
    7. 5.7 Switching Characteristics '240
    8. 5.8 Switching Characteristics '241
    9. 5.9 Switching Characteristics '244
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|20
  • DW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

GUID-20210819-SS0I-RS3H-4S6Z-5LDG7RHWPZTK-low.png J, N, DW, or PW package
20-Pin CDIP, PDIP, SOIC, or TSSOP
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