SCHS212E February   1998  – July 2024 CD54HC4316 , CD74HC4316 , CD74HCT4316

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configurations and Functions
  5. 4 Absolute Maximum Ratings
  6. 5 Thermal Information
  7. 6 Recommended Operating Conditions
  8. 7 Electrical Characteristics: HC Devices
  9. 8 Electrical Characteristics: HCT Devices
  10. 9 Switching Characteristics HC
  11. 10Switching Characteristics HCT
  12. 11Analog Channel Specifications
  13. 12HCT Input Loading Table
  14. 13Recommended Operating Area as a Function of Supply Voltage
  15. 14Typical Performance Curves
  16. 15Parameter Measurement Information
  17. 16Detailed Description
    1. 16.1 Functional Block Diagram
    2. 16.2 Device Functional Modes
  18. 17Device and Documentation Support
    1. 17.1 Receiving Notification of Documentation Updates
    2. 17.2 Support Resources
    3. 17.3 Trademarks
    4. 17.4 Electrostatic Discharge Caution
    5. 17.5 Glossary
  19. 18Revision History
  20. 19Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • NS|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Thermal Information

THERMAL METRIC (1) PW (TSSOP) UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance  127.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.