Refer to the PDF data sheet for device specific package drawings
The ’HC73 and CD74HCT73 utilize silicon gate CMOS technology to achieve operating speeds equivalent to LSTTL parts. They exhibit the low power consumption of standard CMOS integrated circuits, together with the ability to drive 10 LSTTL loads.
PART NUMBER | PACKAGE(1) | BODY SIZE (NOM) |
---|---|---|
CD74HC73M | SOIC (14) | 8.65 mm × 3.90 mm |
CD74HCT73M | SOIC (14) | 8.65 mm × 3.90 mm |
CD74HC73E | PDIP (14) | 19.31 mm × 6.35 mm |
CD74HCT73E | PDIP (14) | 19.31 mm × 6.35 mm |
CD54HC73F | CDIP (14) | 19.55 mm × 6.71 mm |
Changes from Revision F (January 2022) to Revision G (October 2022)
Changes from Revision E (August 2003 ) to Revision F (January 2022)