SCHS122N November   1997  – April 2024 CD54HC4051 , CD54HC4052 , CD54HC4053 , CD54HCT4051 , CD74HC4051 , CD74HC4052 , CD74HC4053 , CD74HCT4051 , CD74HCT4052 , CD74HCT4053

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics: HC Devices
    6. 5.6  Electrical Characteristics: HCT Devices
    7. 5.7  Switching Characteristics, VCC = 5V
    8. 5.8  Switching Characteristics, CL = 50pF
    9. 5.9  Analog Channel Specifications
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC – VEE DC Supply voltage -0.5 10.5 V
VCC –0.5 7 V
VEE 0.5 -7 V
IIK  DC input diode current VI < – 0.5V or VI > VCC + 0.5V –20 20 mA
IOK  DC switch diode current VI < VEE – 0.5V or VI > VCC + 0.5V –20 20 mA
DC switch current(2) VI < VEE – 0.5V or VI > VCC + 0.5V -25 25 mA
ICC DC VCC or ground current –50 50 mA
IEE DC VEE current –20 mA
VSEL or VEN Logic control input pin voltage (EN, Ax, SELx)  –0.5 30 V
TJMAX
Maximum junction temperature		 150 °C
TLMAX
Maximum lead temperature		 Soldering 10 s 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.