SCLS581C April   2004  – July 2024 CD74HCT4066-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Thermal Information
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 HCT Input Loading
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Analog Channel Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

CD74HCT4066-Q1 DW or PW Package, 14-Pin SOIC or TSSOP (Top View) Figure 4-1 DW or PW Package, 14-Pin SOIC or TSSOP (Top View)
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
1Y 1 I/O Input/Output for Switch 1
1Z 2 I/O Input/Output for Switch 1
2Z 3 I/O Input/Output for Switch 2
2Y 4 I/O Input/Output for Switch 2
2E 5 I Control pin for Switch 2
3E 6 I Control pin for Switch 3
GND 7 - Ground Pin
3Y 8 I/O Input/Output for Switch 3
3Z 9 I/O Input/Output for Switch 3
4Z 10 I/O Input/Output for Switch 4
4Y 11 I/O Input/Output for Switch 4
4E 12 I Control pin for Switch 4
1E 13 I Control pin for Switch 1
VCC 14 - Power Pin
(1) Signal Types: I = Input, O = Output, I/O = Input or Output.