SCLS581C April   2004  – July 2024 CD74HCT4066-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Thermal Information
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 HCT Input Loading
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Analog Channel Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.7 Operating Characteristics

VCC = 5V, TA = 25°C, input tr, tf = 6ns
PARAMETER TYP UNIT
Cpd Power dissipation capacitance (see (1)) 38 pF
(1) Cpd is used to determine the dynamic power consumption (PD), per package.
  • PD = (Cpd × VCC 2 × fI) + Σ (CL + CS) × VCC 2 × fO
  • fO = output frequency
  • fI = input frequency
  • CL = output load capacitance
  • CS = switch capacitance
  • VCC = supply voltage