SCLS581C April   2004  – July 2024 CD74HCT4066-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Thermal Information
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 HCT Input Loading
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Analog Channel Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC (see (2)) Supply voltage range −0.5 +7 V
IIK (VI < −0.5V or VI > VCC + 0.5V) Input clamp current ±20 mA
IOK (VO < −0.5V or VO > VCC + 0.5V) Output clamp current ±20 mA
IO (see (3)) (VO > −0.5V or VO < VCC + 0.5V) Switch current ±25 mA
IO (VO > −0.5V or VO < VCC + 0.5V) Output source or sink current per output pin ±25 mA
Continuous current through VCC or GND ±50 mA
Tstg Storage temperature range −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to GND unless otherwise specified.
(3) In certain applications, the external load-resistor current may include both VCC and signal-line components. To avoid drawing VCC current when switch current flows into the transmission gate inputs (terminals 1, 4, 8, and 11), the voltage drop across the bidirectional switch must not exceed 0.6V (calculated from ron values shown in the electrical characteristics table). No VCC current flows through RL if the switch current flows into terminals 2, 3, 9, and 10.