SCLS581C April   2004  – July 2024 CD74HCT4066-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Thermal Information
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Electrical Characteristics
    5. 5.5 HCT Input Loading
    6. 5.6 Switching Characteristics
    7. 5.7 Operating Characteristics
    8. 5.8 Analog Channel Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
  • PW|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VI VCC TA = 25°C TA = −40 TO 125°C UNIT
MIN TYP MAX MIN MAX
IIL Any control VCC or GND 5.5V ±0.1 ±1 µA
IIZ VIS = VCC or GND VIL 5.5V ±0.1 ±1 µA
ron IO = 1mA, See Figure 5-1 VIS = VCC or GND VCC 4.5V 25 80 128 Ω
VIS = VCC to GND VCC 4.5V 35 95 142
∆ron Between any two switches VCC 4.5V 1 Ω
ICC VCC or GND 5.5V 2 40 µA
∆ICC Per input pin: 1 unit load, See (1) VCC − 2.1V 4.5V to 5.5V 100 360 490 µA
CI Control inputs 10 10 pF
(1) For dual-supply systems, theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.