SCHS208E February   1998  – July 2024 CD54HC4066 , CD74HC4066 , CD74HCT4066

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Absolute Maximum Ratings
  7. 6 ESD Ratings
  8. 7 Thermal Information
  9. 8 Recommended Operating Conditions
  10. 9 Electrical Characteristics: HC Devices
  11. 10Electrical Characteristics: HCT Devices
  12. 11Switching Characteristics HC
  13. 12Switching Characteristics HCT
  14. 13Analog Channel Specifications
  15. 14Analog Test Circuits
  16. 15Test Circuits and Waveforms
  17. 16Detailed Description
    1. 16.1 Functional Block Diagram
    2. 16.2 Device Functional Modes
  18. 17Device and Documentation Support
    1. 17.1 Receiving Notification of Documentation Updates
    2. 17.2 Support Resources
    3. 17.3 Trademarks
    4. 17.4 Electrostatic Discharge Caution
    5. 17.5 Glossary
  19. 18Revision History
  20. 19Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VCC HCT DC Supply voltage –0.5 7 V
VCC HC(1) -0.5 10.5 V
IIK  DC input diode current For VI < -0.5V or VI > VCC + 0.5V –20 20 mA
IO  DC switch current(2) For VI< -0.5V or VI > VCC + 0.5V -20 20 mA
IOK  DC Output diode current For VO < -0.5V or VO > VCC + -0.5V -25 25 mA
DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + -0.5V –25 25 mA
ICC DC VCC or ground current –50 50 mA
TJMAX Maximum junction temperature (Plastic Package) 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) In certain applications, the external load-resistor current may include both VCC and signal-line components. To avoid drawing VCC current when switch current flows into the transmission gate inputs, (terminals 1, 4, 8 and 11) the voltage drop across the bidirectional switch must not exceed 0.6V (calculated from RON values shown in the DC Electrical Specifications Table). No VCC current will flow through RLif the switch current flows into terminals 2, 3, 9 and 10. 2.