SCHS212E February   1998  – July 2024 CD54HC4316 , CD74HC4316 , CD74HCT4316

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configurations and Functions
  5. 4 Absolute Maximum Ratings
  6. 5 Thermal Information
  7. 6 Recommended Operating Conditions
  8. 7 Electrical Characteristics: HC Devices
  9. 8 Electrical Characteristics: HCT Devices
  10. 9 Switching Characteristics HC
  11. 10Switching Characteristics HCT
  12. 11Analog Channel Specifications
  13. 12HCT Input Loading Table
  14. 13Recommended Operating Area as a Function of Supply Voltage
  15. 14Typical Performance Curves
  16. 15Parameter Measurement Information
  17. 16Detailed Description
    1. 16.1 Functional Block Diagram
    2. 16.2 Device Functional Modes
  18. 17Device and Documentation Support
    1. 17.1 Receiving Notification of Documentation Updates
    2. 17.2 Support Resources
    3. 17.3 Trademarks
    4. 17.4 Electrostatic Discharge Caution
    5. 17.5 Glossary
  19. 18Revision History
  20. 19Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

17.4 Electrostatic Discharge Caution

CD54HC4316 CD74HC4316 CD74HCT4316 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.