SCHS279E December   1998  – August 2022 CD54HC4511 , CD74HC4511 , CD74HCT4511

PRODUCTION DATA  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Pin Configuration and Functions
  5. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Recommended Operating Conditions for 'HC4511 (1)
    3. 5.3  Recommended Operating Conditions for CD74HCT4511 (1)
    4. 5.4  Thermal Information
    5. 5.5  'HC4511 Electrical Characteristics
    6. 5.6  CD74HCT4511 Electrical Characteristics
    7. 5.7  'HC4511 Timing Requirements
    8. 5.8  Switching Characteristics
    9. 5.9  CD74HCT4511 Timing Requirements
    10. 5.10 CD74HCT4511 Switching Characteristics
    11. 5.11 Operating Characteristics
  6. 6 Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Device Functional Modes
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • N|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage – 0.5 7 V
IIK Input diode current VI < – 0.5 V or VI > VCC + 0.5 V (1) ±20 mA
IOK Output diode current VO < – 0.5 V or VO > VCC + 0.5 V (1) ±20 mA
IO Output source or sink current per output pin VO = 0 to VCC ±25 mA
Continuous current through VCC or GND ±50 mA
TJ Junction temperature 150 °C
Tstg Storage temperature range – 65 150 °C
Lead temperature (During Soldering) At distance 1/16 ± 1/32 in (1.59 ± 0.79 mm) from case for 10 s maximum 265 °C
Unit inserted into a PC board (minimum thickness 1/16 in, 1.59 mm) (with solder contacting lead tips only) 300 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability