SNAS833A November   2021  – May 2022 CDCDB400

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Input
      2. 8.3.2 Output Enable Control
      3. 8.3.3 SMBus
        1. 8.3.3.1 SMBus Address Assignment
    4. 8.4 Device Functional Modes
      1. 8.4.1 CKPWRGD_PD# Function
      2. 8.4.2 OE[3:0]# and SMBus Output Enables
      3. 8.4.3 Output Slew Rate Control
      4. 8.4.4 Output Impedance Control
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 CDCDB400 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Enable Control Method
        2. 9.2.2.2 SMBus Address
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 TICS Pro
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) CDCDB400 UNIT
RHB (QFN)
32 PINS
RθJA Junction-to-ambient thermal resistance 35.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 27.3 °C/W
RθJB Junction-to-board thermal resistance 16.2 °C/W
ΨJT Junction-to-top characterization parameter 0.6 °C/W
ΨJB Junction-to-board characterization parameter 16.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 6.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.