SNAS818B July   2021  – May 2022 CDCDB800

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fail-Safe Input
      2. 8.3.2 Output Enable Control
      3. 8.3.3 SMBus
        1. 8.3.3.1 SMBus Address Assignment
    4. 8.4 Device Functional Modes
      1. 8.4.1 CKPWRGD_PD# Function
      2. 8.4.2 OE[7:0]# and SMBus Output Enables
      3. 8.4.3 Output Slew Rate Control
      4. 8.4.4 Output Impedance Control
    5. 8.5 Programming
    6. 8.6 Register Maps
      1. 8.6.1 CDCDB800 Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Output Enable Control Method
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 TICS Pro
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.2 Layout Examples

Figure 11-1 through Figure 11-3 are printed circuit board (PCB) layout examples that show the application of thermal design practices and a low-inductance ground connection between the device DAP and the PCB.

GUID-20210601-CA0I-32GM-KZW6-MTFWGNXFHPH0-low.png Figure 11-1 PCB Layout Example for CDCDB800, Top layer
GUID-20210603-CA0I-TDPT-4G6B-7ZX51ZTFTX7P-low.png Figure 11-2 PCB Layout Example for CDCDB800, GND Layer
GUID-20210602-CA0I-HHSB-2LTD-K4K1XVMLZKJ8-low.png Figure 11-3 PCB Layout Example for CDCDB800, Bottom Layer