SNAS786B July   2020  – October 2021 CDCE6214-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (cont.)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  EEPROM Characteristics
    6. 7.6  Reference Input, Single-Ended Characteristics
    7. 7.7  Reference Input, Differential Characteristics
    8. 7.8  Reference Input, Crystal Mode Characteristics
    9. 7.9  General-Purpose Input Characteristics
    10. 7.10 Triple Level Input Characteristics
    11. 7.11 Logic Output Characteristics
    12. 7.12 Phase Locked Loop Characteristics
    13. 7.13 Closed-Loop Output Jitter Characteristics
    14. 7.14 Input and Output Isolation
    15. 7.15 Buffer Mode Characteristics
    16. 7.16 PCIe Spread Spectrum Generator
    17. 7.17 LVCMOS Output Characteristics
    18. 7.18 LP-HCSL Output Characteristics
    19. 7.19 LVDS Output Characteristics
    20. 7.20 Output Synchronization Characteristics
    21. 7.21 Power-On Reset Characteristics
    22. 7.22 I2C-Compatible Serial Interface Characteristics
    23. 7.23 Timing Requirements, I2C-Compatible Serial Interface
    24. 7.24 Power Supply Characteristics
    25. 7.25 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Reference Inputs
    2. 8.2 Outputs
    3. 8.3 Serial Interface
    4. 8.4 PSNR Test
    5. 8.5 Clock Interfacing and Termination
      1. 8.5.1 Reference Input
      2. 8.5.2 Outputs
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Reference Block
        1. 9.3.1.1 Zero Delay Mode, Internal and External Path
      2. 9.3.2 Phase-Locked Loop (PLL)
        1. 9.3.2.1 PLL Configuration and Divider Settings
        2. 9.3.2.2 Spread Spectrum Clocking
        3. 9.3.2.3 Digitally-Controlled Oscillator/ Frequency Increment and Decrement - Serial Interface Mode and GPIO Mode
      3. 9.3.3 Clock Distribution
        1. 9.3.3.1 Glitchless Operation
        2. 9.3.3.2 Divider Synchronization
        3. 9.3.3.3 Global and Individual Output Enable
      4. 9.3.4 Power Supplies and Power Management
      5. 9.3.5 Control Pins
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation Modes
        1. 9.4.1.1 Fall-Back Mode
        2. 9.4.1.2 Pin Mode
        3. 9.4.1.3 Serial Interface Mode
    5. 9.5 Programming
      1. 9.5.1 I2C Serial Interface
      2. 9.5.2 EEPROM
        1. 9.5.2.1 EEPROM - Cyclic Redundancy Check
        2. 9.5.2.2 Recommended Programming Procedure
        3. 9.5.2.3 EEPROM Access
          1. 9.5.2.3.1 Register Commit Flow
          2. 9.5.2.3.2 Direct Access Flow
        4. 9.5.2.4 Register Bits to EEPROM Mapping
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Up Sequence
    2. 11.2 Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
      2. 13.1.2 Device Nomenclature
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 qualified for automotive applications
    • Temperature grade 2: –40°C to +105°C
  • Functional Safety-Capable
    • Documentation available to aid functional safety system design
  • Configurable high performance, low-power, frac-N PLL with RMS jitter with spurs (12 kHz – 20 MHz, Fout > 100 MHz) as:
    • Integer mode:
      • Differential output: 350 fs typical, 600 fs maximum
      • LVCMOS output: 1.05 ps typical, 1.5 ps maximum
    • Fractional mode:
      • Differential output: 1.7 ps typical, 2.1 ps maximum
      • LVCMOS output: 2.0 ps typical, 4.0 ps maximum
  • Supports PCIe Gen1/2/3/4 with SSC and Gen 1/2/3/4/5 without SSC
  • 2.335-GHz to 2.625-GHz internal VCO
  • Typical power consumption: 65 mA for 4-output channel, 23 mA for 1-output channel.
  • Universal clock input, two reference inputs for redundancy
    • Differential AC-coupled or LVCMOS: 10 MHz to 200 MHz
    • Crystal: 10 MHz to 50 MHz
  • Flexible output clock distribution
    • 4 channel dividers: Up to 5 unique output frequencies from 24 kHz to 328.125 MHz
    • Combination of LVDS-like, LP-HCSL or LVCMOS outputs on OUT0 – OUT4 pins
    • Glitchless output divider switching and output channel synchronization
    • Individual output enable through GPIO and register
  • Frequency margining options
    • DCO mode: frequency increment/decrement with 10ppb or less step-size
  • Fully-integrated, configurable loop bandwidth: 100 kHz to 1.6 MHz
  • Single or mixed supply for level translation: 1.8 V/2.5 V/3.3 V
  • Configurable GPIOs and flexible configuration options
    • I2C-compatible interface: up to 400 kHz
    • Integrated EEPROM with two pages and external select pin. In-situ programming allowed.
  • Supports 100-Ω systems
  • Low electromagnetic emissions
  • Small footprint: 24-pin VQFN (4 mm × 4 mm)