SNAS852 june   2023 CDCE6214Q1TM

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (cont.)
  7. 6 Device Comparison
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  EEPROM Characteristics
    6. 8.6  Reference Input, Single-Ended Characteristics
    7. 8.7  Reference Input, Differential Characteristics
    8. 8.8  Reference Input, Crystal Mode Characteristics
    9. 8.9  General-Purpose Input Characteristics
    10. 8.10 Triple Level Input Characteristics
    11. 8.11 Logic Output Characteristics
    12. 8.12 Phase Locked Loop Characteristics
    13. 8.13 Closed-Loop Output Jitter Characteristics
    14. 8.14 Input and Output Isolation
    15. 8.15 Buffer Mode Characteristics
    16. 8.16 PCIe Spread Spectrum Generator
    17. 8.17 LVCMOS Output Characteristics
    18. 8.18 LP-HCSL Output Characteristics
    19. 8.19 LVDS Output Characteristics
    20. 8.20 Output Synchronization Characteristics
    21. 8.21 Power-On Reset Characteristics
    22. 8.22 I2C-Compatible Serial Interface Characteristics
    23. 8.23 Timing Requirements, I2C-Compatible Serial Interface
    24. 8.24 Power Supply Characteristics
    25. 8.25 Typical Characteristics
  10. 9 Parameter Measurement Information
    1. 9.1 Reference Inputs
    2. 9.2 Outputs
    3. 9.3 Serial Interface
    4. 9.4 PSNR Test
    5. 9.5 Clock Interfacing and Termination
      1. 9.5.1 Reference Input
      2. 9.5.2 Outputs
  11. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Reference Block
        1. 10.3.1.1 Zero Delay Mode, Internal and External Path
      2. 10.3.2 Phase-Locked Loop (PLL)
        1. 10.3.2.1 PLL Configuration and Divider Settings
        2. 10.3.2.2 Spread Spectrum Clocking
        3. 10.3.2.3 Digitally-Controlled Oscillator and Frequency Increment or Decrement - Serial Interface Mode and GPIO Mode
      3. 10.3.3 Clock Distribution
        1. 10.3.3.1 Glitchless Operation
        2. 10.3.3.2 Divider Synchronization
        3. 10.3.3.3 Global and Individual Output Enable
      4. 10.3.4 Power Supplies and Power Management
      5. 10.3.5 Control Pins
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operation Modes
        1. 10.4.1.1 Fall-Back Mode
        2. 10.4.1.2 Pin Mode
        3. 10.4.1.3 Serial Interface Mode
    5. 10.5 Programming
      1. 10.5.1 I2C Serial Interface
      2. 10.5.2 EEPROM
        1. 10.5.2.1 EEPROM - Cyclic Redundancy Check
        2. 10.5.2.2 Recommended Programming Procedure
        3. 10.5.2.3 EEPROM Access
          1. 10.5.2.3.1 Register Commit Flow
          2. 10.5.2.3.2 Direct Access Flow
        4. 10.5.2.4 Register Bits to EEPROM Mapping
  12. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
      3. 11.2.3 Application Curves
    3. 11.3 Power Supply Recommendations
      1. 11.3.1 Power-Up Sequence
      2. 11.3.2 Decoupling
    4. 11.4 Layout
      1. 11.4.1 Layout Guidelines
      2. 11.4.2 Layout Examples
  13. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
      2. 12.1.2 Device Nomenclature
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.21 Power-On Reset Characteristics

VDD_VCO, VDDO_12, VDDO_34, VDD_REF = 1.8 V ± 5%, 2.5 V ± 5%, 3.3 V ± 5% and TA = -40°C to 105°C
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
VTHRESHOLDPOR threshold voltage(1)0.8751.275V
tSTARTUPStart-up timeStart-up time after VDD reaches 95% to the time outputs are toggling with correct frequency (input = crystal or external clock)9ms
tVDDPower supply ramp time(2)timing requirement for any VDD pin while PDN=LOW0.130ms
(1) POR threshold voltage is the power supply voltage at which the internal reset is deasserted. It is qualified internally with PDN.
(2) VDD pin should monotonically reach 95% of its final value within supply ramp time. Parameters specified by characterization. All VDD pins were tied together for this evaluation. For non-monotonic or slower power supply ramp, it is recommended to pull-down PDN pin until VDD pins have reached 95% of its final value. PDN pin has a 50 kΩ pullup resistor. When PDN pin cannot be actively controlled, TI recommends to add a capacitor to GND on PDN pin to delay the release of reset.