SNAS705D January   2017  – February 2024 CDCE813-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Terminal Configuration
      2. 7.3.2 Default Device Configuration
      3. 7.3.3 I2C Serial Interface
      4. 7.3.4 Data Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 SDA and SCL Hardware Interface
    5. 7.5 Programming
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Spread-Spectrum Clock (SSC)
        2. 8.2.2.2 PLL Frequency Planning
        3. 8.2.2.3 Crystal Oscillator Start-Up
        4. 8.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 8.2.2.5 Unused Inputs and Outputs
        6. 8.2.2.6 Switching Between XO and VCXO Mode
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Register Maps
    1. 9.1 I2C Configuration Registers
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
TEST CONDITIONSMINTYP(1)MAXUNIT
OVERALL PARAMETER
IDDSupply current (see Figure 5-1)All outputs off,
fCLK = 27 MHz,
fVCO = 135 MHz,
fOUT = 27 MHz
All PLLS on11mA
Per PLL9
IDD(OUT)Supply current (see Figure 5-2 )No load, all outputs on,
fOUT = 27 MHz
VDDOUT = 3.3 V1.3mA
IDD(PD)Power-down current. Every circuit powered down except I2CfIN = 0 MHz, VDD = 1.9 V30μA
V(PUC)Supply voltage VDD threshold for power-up control circuit0.851.45V
fVCOVCO frequency range of PLL70230MHz
fOUTLVCMOS output frequencyVDDOUT = 3.3 V230MHz
LVCMOS PARAMETER
VIKLVCMOS input voltageVDD = 1.7 V, II = –18 mA–1.2V
IILVCMOS input currentVI = 0 V or VDD, VDD = 1.9 V±5μA
IIHLVCMOS input current for S0, S1, and S2VI = VDD, VDD = 1.9 V5μA
IILLVCMOS input current for S0, S1, and S2VI = 0 V, VDD = 1.9 V–4μA
CIInput capacitance at Xin/CLKVIClk = 0 V or VDD6pF
Input capacitance at XoutVIXout = 0 V or VDD2
Input capacitance at S0, S1, and S2VIS = 0 V or VDD3
CDCE813-Q1, LVCMOS PARAMETER FOR VDDOUT = 3.3-V MODE
VOHLVCMOS high-level output voltageVDDOUT = 3 V, IOH = –0.1 mA2.9V
VDDOUT = 3 V, IOH = –8 mA2.4
VDDOUT = 3 V, IOH = –12 mA2.2
VOLLVCMOS low-level output voltageVDDOUT = 3 V, IOL = 0.1 mA0.1V
VDDOUT = 3 V, IOL = 8 mA0.5
VDDOUT = 3 V, IOL = 12 mA0.8
tPLH, tPHLPropagation delayPLL bypass3.2ns
PLL enabled (fCLK = fVCO), 70 MHz ≤ fVCO ≤ 85 MHz1.64.3
tr, tfRise and fall timeVDDOUT = 3.3 V (20%–80%)0.6ns
tjit(cc)Cycle-to-cycle jitter(2)1 PLL switching, Y2-to-Y3, 10,000 cycles50200ps
tjit(per)Peak-to-peak period jitter(2)1 PLL switching, Y2-to-Y360200ps
tsk(o)Output skew (see Table 7-2)(3)fOUT = 50 MHz, Y1-to-Y3440ps
odcOutput duty cycle (4)fVCO = 100 MHz, Pdiv = 145%55%
CDCE813-Q1, LVCMOS PARAMETER FOR VDDOUT = 2.5-V MODE
VOHLVCMOS high-level output voltageVDDOUT = 2.3 V, IOH = –0.1 mA2.2V
VDDOUT = 2.3 V, IOH = –6 mA1.7
VDDOUT = 2.3 V, IOH = –10 mA1.6
VOLLVCMOS low-level output voltageVDDOUT = 2.3 V, IOL = 0.1 mA0.1V
VDDOUT = 2.3 V, IOL = 6 mA0.5
VDDOUT = 2.3 V, IOL = 10 mA0.7
tPLH, tPHLPropagation delayPLL bypass3.6ns
tr, tfRise and fall timeVDDOUT = 2.5 V (20%–80%)0.8ns
tjit(cc)Cycle-to-cycle jitter(2)1 PLL switching, Y2-to-Y3, 10,000 cycles50200ps
tjit(per)Peak-to-peak period jitter(2)1 PLL switching, Y2-to-Y360200ps
tsk(o)Output skew (see Table 7-2)(3)fOUT = 50 MHz, Y1-to-Y3440ps
odcOutput duty cycle(4)fVCO = 100 MHz, Pdiv = 145%55%
I2C PARAMETER
VIKSCL and SDA input clamp voltageVDD = 1.7 V, II = –18 mA–1.2V
IIHSCL and SDA input currentVI = VDD, VDD = 1.9 V±10μA
VIHI2C input high voltage(5)0.7 × VDDV
VILI2C input low voltage(5)0.3 × VDDV
VOLSDA low-level output voltageIOL = 3 mA, VDD = 1.7 V0.2 × VDDV
CISCL-SDA input capacitanceVI = 0 V or VDD310pF
EEPROM SPECIFICATION
EEcycProgramming cycles of EEPROM1001000cycles
EEretData retention10years
All typical values are at respective nominal VDD.
Jitter depends on configuration. Jitter data is for input frequency = 27 MHz, fVCO = 108 MHz, fOUT = 27 MHz (measured at Y2).
The tsk(o) specification is only valid for equal loading of each bank of outputs, and the outputs are generated from the same divider.
odc depends on the output rise and fall time (tr and tf); data sampled on the rising edge (tr)
SDA and SCL pins are 3.3-V tolerant.