SCAS844G August   2007  – January 2024 CDCE949 , CDCEL949

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 EEPROM Specification
    7. 5.7 Timing Requirements: CLK_IN
    8. 5.8 Timing Requirements: SDA/SCL
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Terminal Setting
      2. 7.3.2 Default Device Setting
      3. 7.3.3 SDA/SCL Serial Interface
      4. 7.3.4 Data Protocol
    4. 7.4 Device Functional Modes
      1. 7.4.1 SDA/SCL Hardware Interface
    5. 7.5 Programming
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Spread Spectrum Clock (SSC)
        2. 8.2.2.2 PLL Frequency Planning
        3. 8.2.2.3 Crystal Oscillator Start-Up
        4. 8.2.2.4 Frequency Adjustment With Crystal Oscillator Pulling
        5. 8.2.2.5 Unused Inputs and Outputs
        6. 8.2.2.6 Switching Between XO and VCXO Mode
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Register Maps
    1. 9.1 SDA/SCL Configuration Registers
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Related Documentation
    3. 10.3 Related Links
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3 Power Supply Recommendations

There is no restriction on the power-up sequence. In case the VDDOUT is applied first, TI recommends grounding the VDD. In case the VDDOUT is powered while VDD is floating, there is a risk of high current flowing on the VDDOUT.

The device has a power-up control that is connected to the 1.8-V supply. This keeps the whole device disabled until the 1.8-V supply reaches a sufficient voltage level. Then the device switches on all internal components, including the outputs. If there is a 3.3-V VDDOUT available before the 1.8-V, the outputs stay disabled until the 1.8-V supply reaches a certain level.