SCAS759C April   2004  – July 2017 CDCM1802

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics
    7. 6.7  Jitter Characteristics
    8. 6.8  Supply Current Electrical Characteristics
    9. 6.9  Control Input Characteristics
    10. 6.10 Timing Requirements
    11. 6.11 Bias Voltage VBB
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Pin Settings
      2. 8.4.2 Device Behavior During RESET and Control Pin Switching
        1. 8.4.2.1 Output Behavior When Enabling the Device (EN = 0 → 1)
        2. 8.4.2.2 Enabling a Single Output Stage
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 LVPECL Receiver Input Termination
      2. 9.1.2 LVCMOS Receiver Input Termination
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (November 2015) to C Revision

  • Changed pin names for pins 3 and 11 from: IN and Y0 to: IN and Y0.Go
  • Removed duplicate thermal information line from Layout Guidelines.Go

Changes from A Revision (July 2008) to B Revision

  • Added ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go