SCAS931G May   2012  – January 2018 CDCM6208

PRODUCTION DATA.  

1. 1 Features
2. 2 Applications
3. 3 Description
   1.     Device Images
      1.      Simplified Schematic
      2.      Simplified Schematic
4. 4 Revision History
5. 5 Pin Configuration and Functions
   1.     Pin Functions
6. 6 Specifications
   1. 6.1  Absolute Maximum Ratings
   2. 6.2  ESD Ratings
   3. 6.3  Recommended Operating Conditions
   4. 6.4  Thermal Information, Airflow = 0 LFM
   5. 6.5  Thermal Information, Airflow = 150 LFM
   6. 6.6  Thermal Information, Airflow = 250 LFM
   7. 6.7  Thermal Information, Airflow = 500 LFM
   8. 6.8  Single-Ended Input Characteristics (SI_MODE[1:0], SDI/SDA/PIN1, SCL/PIN4, SDO/ADD0/PIN2, SCS/ADD1/PIN3, STATUS1/PIN0, RESETN/PWR, PDN, SYNCN, REF_SEL)
   9. 6.9  Single-Ended Input Characteristics (PRI_REF, SEC_REF)
   10. 6.10 Differential Input Characteristics (PRI_REF, SEC_REF)
   11. 6.11 Crystal Input Characteristics (SEC_REF)
   12. 6.12 Single-Ended Output Characteristics (STATUS1, STATUS0, SDO, SDA)
   13. 6.13 PLL Characteristics
   14. 6.14 LVCMOS Output Characteristics
   15. 6.15 LVPECL (High-Swing CML) Output Characteristics
   16. 6.16 CML Output Characteristics
   17. 6.17 LVDS (Low-Power CML) Output Characteristics
   18. 6.18 HCSL Output Characteristics
   19. 6.19 Output Skew and Sync to Output Propagation Delay Characteristics
   20. 6.20 Device Individual Block Current Consumption
   21. 6.21 Worst Case Current Consumption
   22. 6.22 Timing Requirements, I2C Timing
   23. 6.23 Typical Characteristics
7. 7 Parameter Measurement Information
8. 8 Detailed Description
   1. 8.1 Overview
   2. 8.2 Functional Block Diagram
   3. 8.3 Feature Description
      1. 8.3.1  Typical Device Jitter
      2. 8.3.2  Universal Input Buffer (PRI_REF, SEC_REF)
      3. 8.3.3  VCO Calibration
      4. 8.3.4  Reference Divider (R)
      5. 8.3.5  Input Divider (M)
      6. 8.3.6  Feedback Divider (N)
      7. 8.3.7  Prescaler Dividers (PS_A, PS_B)
      8. 8.3.8  Phase Frequency Detector (PFD)
      9. 8.3.9  Charge Pump (CP)
      10. 8.3.10 Fractional Output Divider Jitter Performance
      11. 8.3.11 Device Block-Level Description
      12. 8.3.12 Device Configuration Control
      13. 8.3.13 Configuring the RESETN Pin
      14. 8.3.14 Preventing False Output Frequencies in SPI/I2C Mode at Start-Up
      15. 8.3.15 Input MUX and Smart Input MUX
   4. 8.4 Device Functional Modes
      1. 8.4.1 Control Pins Definition
      2. 8.4.2 Loop Filter Recommendations for Pin Modes
      3. 8.4.3 Status Pins Definition
      4. 8.4.4 PLL Lock Detect
      5. 8.4.5 Interface and Control
         1. 8.4.5.1 Register File Reference Convention
         2. 8.4.5.2 SPI - Serial Peripheral Interface
            1. 8.4.5.2.1 Writing to the CDCM6208
            2. 8.4.5.2.2 Reading From the CDCM6208
            3. 8.4.5.2.3 Block Write/Read Operation
            4. 8.4.5.2.4 I2C Serial Interface
   5. 8.5 Programming
   6. 8.6 Register Maps
9. 9 Application and Implementation
   1. 9.1 Application Information
   2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
         1. 9.2.2.1  Jitter Considerations in SERDES Systems
         2. 9.2.2.2  Jitter Considerations in ADC and DAC Systems
         3. 9.2.2.3  Configuring the PLL
         4. 9.2.2.4  Programmable Loop Filter
         5. 9.2.2.5  Loop filter Component Selection
         6. 9.2.2.6  Device Output Signaling
         7. 9.2.2.7  Integer Output Divider (IO)
         8. 9.2.2.8  Fractional Output Divider (FOD)
         9. 9.2.2.9  Output Synchronization
         10. 9.2.2.10 Output Mux on Y4 and Y5
         11. 9.2.2.11 Staggered CLK Output Power Up for Power Sequencing of a DSP
10. 10Power Supply Recommendations
    1. 10.1 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
       1. 10.1.1 Mixing Supplies
       2. 10.1.2 Power-On Reset
       3. 10.1.3 Slow Power-Up Supply Ramp
       4. 10.1.4 Fast Power-Up Supply Ramp
       5. 10.1.5 Delaying VDD_Yx_Yy to Protect DSP IOs
    2. 10.2 Device Power-Up Timing
    3. 10.3 Power Down
    4. 10.4 Power Supply Ripple Rejection (PSRR) versus Ripple Frequency
11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Reference Schematics
12. 12Device and Documentation Support
    1. 12.1 Documentation Support
       1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
13. 13Mechanical, Packaging, and Orderable Information