SCAS931G May   2012  – January 2018 CDCM6208

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information, Airflow = 0 LFM
    5. 6.5  Thermal Information, Airflow = 150 LFM
    6. 6.6  Thermal Information, Airflow = 250 LFM
    7. 6.7  Thermal Information, Airflow = 500 LFM
    8. 6.8  Single-Ended Input Characteristics (SI_MODE[1:0], SDI/SDA/PIN1, SCL/PIN4, SDO/ADD0/PIN2, SCS/ADD1/PIN3, STATUS1/PIN0, RESETN/PWR, PDN, SYNCN, REF_SEL)
    9. 6.9  Single-Ended Input Characteristics (PRI_REF, SEC_REF)
    10. 6.10 Differential Input Characteristics (PRI_REF, SEC_REF)
    11. 6.11 Crystal Input Characteristics (SEC_REF)
    12. 6.12 Single-Ended Output Characteristics (STATUS1, STATUS0, SDO, SDA)
    13. 6.13 PLL Characteristics
    14. 6.14 LVCMOS Output Characteristics
    15. 6.15 LVPECL (High-Swing CML) Output Characteristics
    16. 6.16 CML Output Characteristics
    17. 6.17 LVDS (Low-Power CML) Output Characteristics
    18. 6.18 HCSL Output Characteristics
    19. 6.19 Output Skew and Sync to Output Propagation Delay Characteristics
    20. 6.20 Device Individual Block Current Consumption
    21. 6.21 Worst Case Current Consumption
    22. 6.22 Timing Requirements, I2C Timing
    23. 6.23 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Typical Device Jitter
      2. 8.3.2  Universal Input Buffer (PRI_REF, SEC_REF)
      3. 8.3.3  VCO Calibration
      4. 8.3.4  Reference Divider (R)
      5. 8.3.5  Input Divider (M)
      6. 8.3.6  Feedback Divider (N)
      7. 8.3.7  Prescaler Dividers (PS_A, PS_B)
      8. 8.3.8  Phase Frequency Detector (PFD)
      9. 8.3.9  Charge Pump (CP)
      10. 8.3.10 Fractional Output Divider Jitter Performance
      11. 8.3.11 Device Block-Level Description
      12. 8.3.12 Device Configuration Control
      13. 8.3.13 Configuring the RESETN Pin
      14. 8.3.14 Preventing False Output Frequencies in SPI/I2C Mode at Start-Up
      15. 8.3.15 Input MUX and Smart Input MUX
    4. 8.4 Device Functional Modes
      1. 8.4.1 Control Pins Definition
      2. 8.4.2 Loop Filter Recommendations for Pin Modes
      3. 8.4.3 Status Pins Definition
      4. 8.4.4 PLL Lock Detect
      5. 8.4.5 Interface and Control
        1. 8.4.5.1 Register File Reference Convention
        2. 8.4.5.2 SPI - Serial Peripheral Interface
          1. 8.4.5.2.1 Writing to the CDCM6208
          2. 8.4.5.2.2 Reading From the CDCM6208
          3. 8.4.5.2.3 Block Write/Read Operation
          4. 8.4.5.2.4 I2C Serial Interface
    5. 8.5 Programming
    6. 8.6 Register Maps
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedures
        1. 9.2.2.1  Jitter Considerations in SERDES Systems
        2. 9.2.2.2  Jitter Considerations in ADC and DAC Systems
        3. 9.2.2.3  Configuring the PLL
        4. 9.2.2.4  Programmable Loop Filter
        5. 9.2.2.5  Loop filter Component Selection
        6. 9.2.2.6  Device Output Signaling
        7. 9.2.2.7  Integer Output Divider (IO)
        8. 9.2.2.8  Fractional Output Divider (FOD)
        9. 9.2.2.9  Output Synchronization
        10. 9.2.2.10 Output Mux on Y4 and Y5
        11. 9.2.2.11 Staggered CLK Output Power Up for Power Sequencing of a DSP
  10. 10Power Supply Recommendations
    1. 10.1 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
      1. 10.1.1 Mixing Supplies
      2. 10.1.2 Power-On Reset
      3. 10.1.3 Slow Power-Up Supply Ramp
      4. 10.1.4 Fast Power-Up Supply Ramp
      5. 10.1.5 Delaying VDD_Yx_Yy to Protect DSP IOs
    2. 10.2 Device Power-Up Timing
    3. 10.3 Power Down
    4. 10.4 Power Supply Ripple Rejection (PSRR) versus Ripple Frequency
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Reference Schematics
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.19 Output Skew and Sync to Output Propagation Delay Characteristics

VDD_Yx_Yy = 1.71 to 1.89 V, 2.375 V to 2.625 V, 3.135V to 3.465 V, TA = –40°C to 85°C
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
tPD-PS Propagation delay SYNCN↑ to output toggling high V1: f VCO= 2.5 GHz PS_A=4 9 10.5 11 1/f PS_A
PS_A=5 9 10.2 11 1/f PS_A
PS_A=6 9 10.0 11 1/f PS_A
V2: f VCO= 3 GHz PS_A=4 10 10.9 12 1/f PS_A
PS_A=5 9 10.5 11 1/f PS_A
PS_A=6 9 10.2 11 1/f PS_A
ΔtPD-PS Part-to-part propagation delay variation SYNCN↑ to output toggling high(1) Fixed supply voltage, temp, and device setting(1) 0 1 1/f PS_A
OUTPUT SKEW – ALL OUTPUTS USE IDENTICAL OUTPUT SIGNALING, INTEGER DIVIDERS ONLY; PS_A = PS_B = 6, OUTDIV = 4
tSK,LVDS Skew between Y[7:4] LVDS Y[7:4] = LVDS 40 ps
tSK,LVDS Skew between Y[3:0] LVDS Y[3:0] = LVDS 40 ps
tSK,LVDS Skew between Y[7:0] LVDS Y[7:0] = LVDS 80 ps
tSK,CML Skew between Y[3:0] CML Y[3:0] = CML 40 ps
tSK,PECL Skew between Y[3:0] PECL Y[3:0] = LVPECL 40 ps
tSK,HCSL Skew between Y[7:4] HCSL Y[7:4] = HCSL 40 ps
tSK,SE Skew between Y[7:4] CMOS Y[7:4] = CMOS 50 ps
OUTPUT SKEW - MIXED SIGNAL OUTPUT CONFIGURATION, INTEGER DIVIDERS ONLY; PS_A = PS_B = 6, OUTDIV = 4
tSK,CMOS-LVDS Skew between Y[7:4] LVDS and CMOS mixed Y[4] = CMOS, Y[7:5] = LVDS 2.5 ns
tSK,CMOS-PECL Skew between Y[7:0] CMOS and LVPECL mixed Y[7:4] = CMOS, Y[3:0] = LVPECL 2.5 ns
tSK,PECL-LVDS Skew between Y[3:0] LVPECL and LVDS mixed Y[0] = LVPECL, Y[3:1] = LVDS 120 ps
tSK,PECL-CML Skew between Y[3:0] LVPECL and CML mixed Y[0] = LVPECL, Y[3:1] = CML 40 ps
tSK,LVDS-PECL Skew between Y[7:0] LVDS and LVPECL mixed Y[7:4] = LVDS, Y[3:0] = LVPECL 180 ps
tSK,LVDS-HCSL Skew between Y[7:4] LVDS and HCSL mixed Y[4] = LVDS, Y[7:5] = HCSL 250 ps
OUTPUT SKEW - USING FRACTIONAL OUTPUT DIVISION; PS_A = PS_B = 6, OUTDIV = 3.125
tSK,DIFF, frac Skew between Y[7:4] LVDS using all fractional divider with the same divider setting Y[7:4] = LVDS 200 ps
(1) SYNC is toggled 10,000 times for each device. Test is repeated over process voltage and temperature (PVT).