SCAS943
May 2015
CDCM6208V1F
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Simplified Schematics
5
Revision History
6
Description (continued)
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information, Airflow = 0 LFM
8.5
Thermal Information, Airflow = 150 LFM
8.6
Thermal Information, Airflow = 250 LFM
8.7
Thermal Information, Airflow = 500 LFM
8.8
Single Ended Input Characteristics
8.9
Single Ended Input Characteristics (PRI_REF, SEC_REF)
8.10
Differential Input Characteristics (PRI_REF, SEC_REF)
8.11
Crystal Input Characteristics (SEC_REF)
8.12
Single Ended Output Characteristics (STATUS1, STATUS0, SDO, SDA)
8.13
PLL Characteristics
8.14
LVCMOS Output Characteristics
8.15
LVPECL (High-Swing CML) Output Characteristics
8.16
CML Output Characteristics
8.17
LVDS (Low-Power CML) Output Characteristics
8.18
HCSL Output Characteristics
8.19
Output Skew and Sync to Output Propagation Delay Characteristics
8.20
Device Individual Block Current Consumption
8.21
Worst Case Current Consumption
8.22
I2C TIMING
8.23
SPI Timing Requirements
8.24
Typical Characteristics
8.24.1
Fractional Output Divider Jitter Performance
8.24.2
Power Supply Ripple Rejection (PSRR) versus Ripple Frequency
9
Parameter Measurement Information
9.1
Characterization Test Setup
10
Detailed Description
10.1
Overview
10.2
Functional Block Diagram
10.3
Feature Description
10.4
Device Functional Modes
10.4.1
Control Pins Definition
10.4.2
Loop Filter Recommendations for Pin Modes
10.4.3
Status Pins Definition
10.4.4
PLL Lock Detect
10.4.5
Interface and Control
10.4.5.1
Register File Reference Convention
10.4.5.2
SPI - Serial Peripheral Interface
10.4.5.2.1
Configuring the PLL
10.5
Programming
10.5.1
Writing to the CDCM6208V1F
10.5.2
Reading from the CDCM6208V1F
10.5.3
Block Write/Read Operation
10.5.4
I2C Serial Interface
10.6
Register Maps
11
Application and Implementation
11.1
Application Information
11.2
Typical Applications
11.2.1
Design Requirements
11.2.1.1
Device Block-level Description
11.2.1.2
Device Configuration Control
11.2.1.3
Configuring the RESETN Pin
11.2.1.4
Preventing False Output Frequencies in SPI/I2C Mode at Startup:
11.2.1.5
Power Down
11.2.1.6
Device Power Up Timing:
11.2.1.7
Input Mux and Smart Input Mux
11.2.1.8
Universal INPUT Buffer (PRI_REF, SEC_REF)
11.2.1.9
VCO Calibration
11.2.1.10
Reference Divider (R)
11.2.1.11
Input Divider (M)
11.2.1.12
Feedback Divider (N)
11.2.1.13
Prescaler Dividers (PS_A, PS_B)
11.2.1.14
Phase Frequency Detector (PFD)
11.2.1.15
Charge Pump (CP)
11.2.1.16
Programmable Loop Filter
11.2.1.16.1
Loop Filter Component Selection
11.2.1.16.2
Device Output Signaling
11.2.1.16.3
Integer Output Divider (IO)
11.2.1.16.4
Fractional Output Divider (FOD)
11.2.1.16.5
Output Synchronization
11.2.1.16.6
Output MUX on Y4 and Y5
11.2.1.16.7
Staggered CLK Output Powerup for Power Sequencing of a DSP
11.2.2
Detailed Design Procedure
11.2.2.1
Jitter Considerations in SERDES Systems
11.2.2.2
Jitter Considerations in ADC and DAC Systems
11.2.3
Application Performance Plots
11.2.3.1
Typical Device Jitter
12
Power Supply Recommendations
12.1
Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
12.1.1
Fast Power-up Supply Ramp
12.1.2
Delaying VDD_Yx_Yy to Protect DSP IOs
13
Layout
13.1
Layout Guidelines
13.2
Layout Example
13.2.1
Reference Schematic
14
Device and Documentation Support
14.1
Trademarks
14.2
Documentation Support
14.2.1
Related Documentation
14.3
Electrostatic Discharge Caution
14.4
Glossary
15
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RGZ|48
MPQF123F
Thermal pad, mechanical data (Package|Pins)
RGZ|48
QFND014T
Orderable Information
scas943_oa
scas943_pm
5 Revision History
DATE
REVISION
NOTES
May 2015
*
Initial release.