SGLS390G July   2009  – November 2015 CDCM7005-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Automatic/Manual Reference Clock Switching
      2. 9.3.2 PLL Lock for Analog and Digital Detect
        1. 9.3.2.1 PLL Lock/Out-of-Lock Definition
        2. 9.3.2.2 Digital vs Analog Lock
      3. 9.3.3 Differential LVPECL Outputs and Single-Ended LVCMOS Outputs
      4. 9.3.4 Frequency Hold-Over Mode
      5. 9.3.5 Charge Pump Preset to VCC_CP / 2
      6. 9.3.6 Charge Pump Current Direction
    4. 9.4 Device Functional Modes
    5. 9.5 Programming
      1. 9.5.1 SPI Control Interface
      2. 9.5.2 Functional Description of the Logic
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Clock Generation for Interpolating DACs With the CDCM7005-SP
        1. 10.1.1.1 AC-Coupled Interface to ADC/DAC
      2. 10.1.2 Phase Noise Performance
        1. 10.1.2.1 In-Band Noise Performance
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Community Resources
    2. 13.2 Trademarks
    3. 13.3 Electrostatic Discharge Caution
    4. 13.4 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • HFG|52
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Parameter Measurement Information

CDCM7005-SP T0058-01_gls390.gif Figure 10. LVPECL Differential Output Voltage and Rise/Fall Time
CDCM7005-SP T0059-01_gls390.gif
A. Output skew, tsk(o), is calculated as the greater of:
The difference between the fastest and the slowest tpd(LH)n (n = 0...4)
The difference between the fastest and the slowest tpd(HL)n (n = 0...4)
B. Pluse skew, tsk(p), is calculated as the magnitude of the absolute time difference between the high-to-low (tpd(HL)) and the low-to-high (tpd(LH)) propagation delays when a single switching input causes one or more outputs to switch,
tsk(p) = |tpd(HL) – tpd(LH) |. Pulse skew is sometimes refered to as pulse width distortion or duty cycle skew.
Figure 11. Output Skew
CDCM7005-SP T0060-01_gls390.gif Figure 12. Phase Offset
CDCM7005-SP S0079-01_gls390.gif Figure 13. LVCMOS Output Loading During Device Test
CDCM7005-SP S0078-01_gls390.gif Figure 14. LVPECL Output Loading During Device Test