11.1 Layout Guidelines

Figure 12 shows a conceptual layout detailing recommended placement of power supply bypass capacitors. For component side mounting, use 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low-impedance connection to the ground plane.

11.2 Layout Example

Figure 12. PCB Conceptual Layout

11.3 Thermal Considerations

CDCVF2310 supports high ambient temperature up to 105°C. The system designer needs to ensure that the maximum junction temperature is not exceeded. Following Equation 1 can be used to calculate the junction temperature based on the measured case temperature. The case temperature is defined as the hottest temperature on the top of the device. The case temperature measurement can be performed with (in order of accuracy) an IR camera, a fluor-optic probe, a thermocouple, or IR gun with a maximum field view of 4-mm diameter just to name a few techniques. Further information can be found at SPRA953 and SLUA566