over operating free-air temperature range (unless otherwise noted)(1) | UNIT |
---|
AVCC | Supply voltage range (2) | AVCC < VCC +0.7 V |
VCC | Supply voltage range | –0.5 V to 4.3 V |
VI | Input voltage range (3) | –0.5 V to 4.6 V |
VO | Voltage range applied to any output in the high or low state(3)(4) | –0.5 V to VCC + 0.5 V |
IIK | Input clamp current (VI< 0) | –50 mA |
IOK | Output clamp current (VO< 0 or VO > VCC) | ±50 mA |
IO | Continuous output current (VO = 0 to VCC) | ±50 mA |
| Continuous current through each VCC or GND | ±100 mA |
| Maximum power dissipation at TA = 55°C (in still air)(5) | 0.7 W |
Tstg | Storage temperature range | –65°C to 150°C |
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) AVCCmust not exceed VCC+ 0.7 V
(3) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) This value is limited to 4.6 V maximum.
(5) The maximum package power dissipation is calculated using a junction temperature of 150°C and a board trace length of 750 mils. For more information, see the
Package Thermal Considerations application note in the
ABT Advanced BiCMOS Technology Data Book (
SCBD002).