SCAS637E April   2004  – February 2024 CDCVF2509

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5.   Pin Configuration and Functions
  6. 4Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Dissipation Ratings
    3. 4.3 Recommended Operating Conditions
    4. 4.4 Package Thermal Resistance
    5. 4.5 Electrical Characteristics
    6. 4.6 Timing Requirements
    7. 4.7 Switching Characteristics
    8. 4.8 Typical Characteristics
  7. 5Parameter Measurement Information
  8. 6Device and Documentation Support
    1. 6.1 Documentation Support
      1. 6.1.1 Related Documentation
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  9. 7Revision History
  10. 8Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4.4 Package Thermal Resistance

CDCVF2509APW 24-PIN TSSOP(1) THERMAL AIRFLOW (CFM) UNIT
0 150 250 500
RθJA High K 88 83 81 77 °C/W
RθJC High K 26.5
(1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).