SLPS218D August   2009  – October 2023 CSD16325Q5

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5.   Revision History
  6. 4Electrical Characteristics
  7. 5Thermal Characteristics
  8. 6Typical MOSFET Characteristics
  9. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Thermal Characteristics

(TA = 25°C unless otherwise stated)
PARAMETER MIN TYP MAX UNIT
RθJC Thermal Resistance Junction to Case(1) 1 °C/W
RθJA Thermal Resistance Junction to Ambient(1) (2) 50 °C/W
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
GUID-F18CFC9A-2910-4F26-85FD-065C70933EB0-low.gif
Max RθJA = 50°C/W when mounted on 1 inch2 (6.45 cm2) of 2-oz. (0.071-mm thick) Cu.
GUID-87F0FF55-6BE9-4B52-859B-9DCE19B0C717-low.gif
Max RθJA = 126°C/W when mounted on minimum pad area of 2-oz. (0.071-mm thick) Cu.