SLPS202B August   2009  – December 2015 CSD16406Q3

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Community Resources
    2. 6.2 Trademarks
    3. 6.3 Electrostatic Discharge Caution
    4. 6.4 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (September 2010) to B Revision

  • Added part number to title Go
  • Added Silicon Limited ID, TC = 25°C Go
  • Added Power Dissipation, TC = 25°C Go
  • Updated Typical RθJA Go
  • Updated pulsed current conditions Go
  • Added Device and Documentation Support section Go
  • Updated Mechanical, Packaging, and Orderable Information Go

Changes from * Revision (August 2009) to A Revision

  • Deleted the Package Marking Information section.Go