SLPS228B October   2009  – October 2023 CSD16408Q5

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Revision History
  6. 5Electrical Characteristics
  7. 6Thermal Characteristics
  8. 7Typical MOSFET Characteristics
  9. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Thermal Characteristics

TA = 25°C unless otherwise stated
PARAMETER MIN TYP MAX UNIT
RθJC Thermal Resistance Junction to Case(1) 1.9 °C/W
RθJA Thermal Resistance Junction to Ambient(1) (2) 51 °C/W
(1) RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
(2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
GUID-7522A92D-DD61-43A1-BCBE-C500BD8D94C4-low.gif
Max RθJA = 51°C/W when mounted on 1 inch2 (6.45 cm2) of 2-oz. (0.071-mm thick) Cu.
GUID-19CACCE3-3753-459F-A224-09F8CFF44350-low.gif
Max RθJA = 125°C/W when mounted on minimum pad area of 2-oz. (0.071-mm thick) Cu.