SLPS206B August   2009  – November 2016 CSD16411Q3

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q3 Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q3 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQG|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (September 2010) to B Revision

  • Changed Description textGo
  • Added silicon limited continuous drain current to Absolute Maximum Ratings tableGo
  • Added max power dissipation at TC = 25°C to Absolute Maximum Ratings tableGo
  • Changed Note 2 in Absolute Maximum Ratings tableGo
  • Changed R θJA max from 59°C/W : to 55°C/WGo
  • Changed the SOA in Figure 10 to reflect measured dataGo
  • Added Device and Documentation Support sectionGo
  • Changed MECHANICAL DATA section to Mechanical, Packaging, and Orderable Information sectionGo

Changes from * Revision (August 2009) to A Revision

  • Changed Figure 1 text From: RθJA = 92°C/W To: Typical RθJA = 93°C/WGo
  • Changed Figure 10 text From: RθJA = 92°C/W To: Typical RθJA = 93°C/WGo
  • Changed Figure 11 X-axis valuesGo