SLPS261B March 2010 – September 2014 CSD17309Q3
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
DIM | MILLIMETERS | INCHES | ||||
---|---|---|---|---|---|---|
MIN | NOM | MAX | MIN | NOM | MAX | |
A | 0.950 | 1.000 | 1.100 | 0.037 | 0.039 | 0.043 |
A1 | 0.000 | 0.000 | 0.050 | 0.000 | 0.000 | 0.002 |
b | 0.280 | 0.340 | 0.400 | 0.011 | 0.013 | 0.016 |
b1 | 0.310 NOM | 0.012 NOM | ||||
c | 0.150 | 0.200 | 0.250 | 0.006 | 0.008 | 0.010 |
D | 3.200 | 3.300 | 3.400 | 0.126 | 0.130 | 0.134 |
D2 | 1.650 | 1.750 | 1.800 | 0.065 | 0.069 | 0.071 |
d | 0.150 | 0.200 | 0.250 | 0.006 | 0.008 | 0.010 |
d1 | 0.300 | 0.350 | 0.400 | 0.012 | 0.014 | 0.016 |
E | 3.200 | 3.300 | 3.400 | 0.126 | 0.130 | 0.134 |
E2 | 2.350 | 2.450 | 2.550 | 0.093 | 0.096 | 0.100 |
e | 0.650 TYP | 0.026 | ||||
H | 0.35 | 0.450 | 0.550 | 0.014 | 0.018 | 0.022 |
K | 0.650 TYP | 0.026 TYP | ||||
L | 0.35 | 0.450 | 0.550 | 0.014 | 0.018 | 0.022 |
L1 | 0 | — | 0 | 0 | — | 0 |
θ | 0 | — | 0 | 0 | — | 0 |
For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing Through PCB Layout Techniques.
All dimensions are in mm, unless otherwise specified.
Notes: