SLPS260E March 2010 – September 2015 CSD17313Q2
PRODUCTION DATA.
- 1Features
- 2Applications
- 3Description
- 4Revision History
- 5 Specifications
- 6Device and Documentation Support
- 7Mechanical, Packaging, and Orderable Information
Package Options
Refer to the PDF data sheet for device specific package drawings
Mechanical Data (Package|Pins)
- DQK|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information
7 Mechanical, Packaging, and Orderable Information
7.1 Q2 Package Dimensions
| DIM | MILLIMETERS | INCHES | ||||
|---|---|---|---|---|---|---|
| MIN | NOM | MAX | MIN | NOM | MAX | |
| A | 0.700 | 0.750 | 0.800 | 0.028 | 0.030 | 0.032 |
| A1 | 0.000 | 0.050 | 0.000 | 0.002 | ||
| b | 0.250 | 0.300 | 0.350 | 0.010 | 0.012 | 0.014 |
| C | 0.203 TYP | 0.008 TYP | ||||
| D | 2.000 TYP | 0.080 TYP | ||||
| D1 | 0.900 | 0.950 | 1.000 | 0.036 | 0.038 | 0.040 |
| D2 | 0.300 TYP | 0.012 TYP | ||||
| E | 2.000 TYP | 0.080 TYP | ||||
| E1 | 0.900 | 1.000 | 1.100 | 0.036 | 0.040 | 0.044 |
| E2 | 0.280 TYP | 0.0112 TYP | ||||
| E3 | 0.470 TYP | 0.0188 TYP | ||||
| e | 0.650 BSC | 0.026 TYP | ||||
| K | 0.280 TYP | 0.0112 TYP | ||||
| K1 | 0.350 TYP | 0.014 TYP | ||||
| K2 | 0.200 TYP | 0.008 TYP | ||||
| K3 | 0.200 TYP | 0.008 TYP | ||||
| K4 | 0.470 TYP | 0.0188 TYP | ||||
| L | 0.200 | 0.25 | 0.300 | 0.008 | 0.010 | 0.012 |
7.2 Recommended PCB Pattern
For recommended circuit layout for PCB designs, see application note SLPA005 – Reducing Ringing through PCB Layout Techniques.
