SLPS550D May   2015  – February 2022 CSD17484F4

PRODUCTION DATA  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Trademarks
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Mechanical Dimensions
    2. 7.2 Recommended Minimum PCB Layout
    3. 7.3 Recommended Stencil Pattern

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YJJ|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision C (December 2019) to Revision D (February 2022)

  • Added FemtoFET Surface Mount Guide note.Go

Changes from Revision B (September 2017) to Revision C (December 2019)

  • Changed On-State Resistance vs Gate-to-Source Voltage by truncating VGS from 20 V to 12 VGo

Changes from Revision A (August 2017) to Revision B (September 2017)

  • Deleted the CSD68830F4 Embossed Carrier Tape Dimensions sectionGo

Changes from Revision * (May 2015) to Revision A (August 2017)