SLPS387C January   2016  – November 2023 CSD17552Q3A

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Support Resources
    2. 5.2 Trademarks
    3. 5.3 Electrostatic Discharge Caution
    4. 5.4 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Trademarks

NexFET™ and TI E2E™ are trademarks of Texas Instruments.

All trademarks are the property of their respective owners.