SLPS663C March   2017  – March 2024 CSD18510KCS

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Receiving Notification of Documentation Updates
    2. 5.2 Support Resources
    3. 5.3 Trademarks
    4. 5.4 Electrostatic Discharge Caution
    5. 5.5 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

This 40V, 1.4mΩ, TO-220 NexFET™ power MOSFET is designed to minimize losses in power conversion applications.

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Product Summary
TA = 25°C TYPICAL VALUE UNIT
VDS Drain-to-Source Voltage 40 V
Qg Gate Charge Total (10V) 118 nC
Qgd Gate Charge Gate-to-Drain 21 nC
RDS(on) Drain-to-Source On-Resistance VGS = 4.5V 2.0 mΩ
VGS = 10V 1.4
VGS(th) Threshold Voltage 1.7 V
Device Information(1)
DEVICEMEDIAQTYPACKAGESHIP
CSD18510KCSTube50TO-220
Plastic Package
Tube
For all available packages, see the orderable addendum at the end of the data sheet.
Absolute Maximum Ratings
TA = 25°CVALUEUNIT
VDSDrain-to-Source Voltage40V
VGSGate-to-Source Voltage±20V
IDContinuous Drain Current (Package Limited)200A
Continuous Drain Current (Silicon Limited), TC = 25°C288
Continuous Drain Current (Silicon Limited), TC = 100°C204
IDMPulsed Drain Current(1)400A
PDPower Dissipation250W
TJ,
Tstg
Operating Junction,
Storage Temperature
–55 to 175°C
EASAvalanche Energy, Single Pulse
ID = 81A, L = 0.1mH, RG = 25Ω
328mJ
Max RθJC = 0.6°C/W, pulse duration ≤ 100μs, duty cycle ≤ 1%.
GUID-5C21E949-D7A2-4412-9971-67CD7FDB678D-low.gif RDS(on) vs VGS
GUID-AB9BC7D3-B627-404F-AF33-22802BFB7957-low.gif Gate Charge