SLPS684 July   2017 CSD18511KTT

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 KTT Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

7.1 KTT Package Dimensions

CSD18511KTT MechDwg.png

Notes:

  1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
  2. This drawing is subject to change without notice.
  3. Features may not exist and shape may vary per different assembly sites.

Table 1. Pin Configuration

POSITION DESIGNATION
Pin 1 Gate
Pin 2 / Tab Drain
Pin 3 Source

7.2 Recommended PCB Pattern

CSD18511KTT Mask.png

For recommended circuit layout for PCB designs, see Reducing Ringing Through PCB Layout Techniques (SLPA005).

7.3 Recommended Stencil Opening (0.125 mm Stencil Thickness)

CSD18511KTT Stencil.png

Notes:

  1. This package is designed to be soldered to a thermal pad on the board. See PowerPAD™ Thermally Enhanced Package (SLMA002) and PowerPAD™ Made Easy (SLMA004) for more information.
  2. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
  3. Board assembly site may have different recommendations for stencil design.