SLPS322D November   2012  – February 2018 CSD18532Q5B

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
    1.     Top View
      1.      Device Images
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q5B Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 Q5B Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (May 2017) to D Revision

Changes from B Revision (July 2014) to C Revision

  • Added the Receiving Notification of Documentation Updates and Community Resources sections to Device and Documentation Support. Go
  • Changed the dimension between pads 3 and 4 from 0.028 inches: to 0.050 inches in the Recommended PCB Pattern section diagram Go

Changes from A Revision (May 2014) to B Revision

  • Changed "7-Inch Reel" to state "13-Inch Reel". Go

Changes from * Revision (Nov 2012) to A Revision

  • Updated the device description. Go
  • Specified Qg at 10 V. Go
  • Added small reel option. Go
  • Increased pulsed drain current to 400 A. Go
  • Added line for max power dissipation with case temperature held to 25°C. Go
  • Updated the pulsed drain current conditions. Go
  • Eliminated Qg at 4.5 V. Go
  • Changed Figure 1 from a normalized RθJA curve to a RθJC curveGo
  • Updated the safe operating area in Figure 10. Go
  • Updated the mechanical drawing. Go