SLPS388B September   2012  – January 2015 CSD18533Q5A

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q5A Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q5A Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQJ|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (May 2013) to B Revision

  • Added part number to title Go
  • Increased Pulsed Drain Current to 267 A Go
  • Added line for max power dissipation with case temperature held to 25° CGo
  • Updated pulsed current conditions Go
  • Changed Figure 1 to normalized RθJC curve Go
  • Updated SOA in Figure 10Go

Changes from * Revision (September 2012) to A Revision

  • Changed the RθJC MAX value From: 2.3°C/W to 1.3°C/WGo
  • Changed From: Max RθJA = 121°C/W To: Max RθJA = 125°C/W Go
  • Changed Typ RthJA = 99°C/W To:RthJA = 100°C/W in Figure 1Go
  • Added the Recommended Stencil Opening sectionGo