SLPS391B June   2013  – July 2014 CSD18537NQ5A

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Trademarks
    2. 6.2 Electrostatic Discharge Caution
    3. 6.3 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q5A Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Opening
    4. 7.4 Q5A Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQJ|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (February 2014) to B Revision

  • Reduced silicon current limit to 54 A due to increase in RθJCGo
  • Increased pulsed current limit to 151 Go
  • Added line for maximum power dissipation with case temperature held to 25ºC Go
  • Updated the pulsed current conditions Go
  • Increased the maximum RθJC to 2.1 ºC/W Go
  • Updated Figure 1 from a normalized RθJA curve to an RθJC curveGo
  • Updated Figure 10 to show an improved SOAGo
  • Updated Figure 12 to show a 50-A package current limit Go

Changes from * Revision (June 2013) to A Revision

  • Added part number to titleGo
  • Added more information to descriptionGo
  • Updated ordering information to include small reel informationGo
  • Removed TC = 25°C condition from package limited continuous drain currentGo