SLPS413B December   2013  – May 2017 CSD19502Q5B

PRODUCTION DATA.  

  1. 1Features
  2. 2Applications
  3. 3Description
  4. 4Revision History
  5. 5Specifications
    1. 5.1 Electrical Characteristics
    2. 5.2 Thermal Information
    3. 5.3 Typical MOSFET Characteristics
  6. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Community Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  7. 7Mechanical, Packaging, and Orderable Information
    1. 7.1 Q5B Package Dimensions
    2. 7.2 Recommended PCB Pattern
    3. 7.3 Recommended Stencil Pattern
    4. 7.4 Q5B Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DNK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (June 2014) to B Revision

  • Added the Receiving Notification of Documentation Updates and Community Resources sections to Device and Documentation Support. Go
  • Changed the dimension between pads 3 and 4 from 0.028 inches: to 0.050 inches in the Recommended PCB Pattern section diagram Go

Changes from * Revision (December 2013) to A Revision

  • Added small reel option to ordering information table. Go
  • Increased silicon limit for continuous drain current to 157 A. Go
  • Increased max pulsed current to 400 A. Go
  • Added max power rating when the case temperature is held to 25°C. Go
  • Updated pulsed current conditions to specify duty cycle ≤ 1%, pulse duration ≤ 100 µs, and Max RθJC = 0.8ºC/W. Go
  • Updated Figure 10. Go
  • Updated mechanical drawing. Go