SLPS407D September   2013  – May 2024 CSD19531KCS

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Specifications
    1. 4.1 Electrical Characteristics
    2. 4.2 Thermal Information
    3. 4.3 Typical MOSFET Characteristics
  6. 5Device and Documentation Support
    1. 5.1 Third-Party Products Disclaimer
    2. 5.2 Documentation Support
      1. 5.2.1 Related Documentation
    3. 5.3 Receiving Notification of Documentation Updates
    4. 5.4 Support Resources
    5. 5.5 Trademarks
    6. 5.6 Electrostatic Discharge Caution
    7. 5.7 Glossary
  7. 6Revision History
  8. 7Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • KCS|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision C (March 2017) to Revision D (May 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo

Changes from Revision B (June 2014) to Revision C (March 2017)

    Changes from Revision A (May 2014) to Revision B (June 2014)

    • Added value for max Qg Go

    Changes from Revision * (September 2013) to Revision A (May 2014)

    • Updated the silicon limited currents to reflect increase in device operating temperature range Go
    • Increased pulsed current to reflect new conditions Go
    • Increased max power dissipation to reflect new conditions Go
    • Increased operating and junction temperature range to 175°C Go
    • Updated the pulsed drain current conditionsGo
    • Changed Figure 4-1 from a normalized RθJA curve to a normalized RθJC curve Go
    • Updated Figure 4-6 to reflect increase in device operating temperature range Go
    • Updated Figure 4-8 to reflect increase in device operating temperature range Go
    • Updated Figure 4-10 to reflect measured SOA data Go
    • Updated Figure 4-12 to reflect increase in device operating temperature range Go